- 07 Nov, 2017 1 commit
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Grace Copplestone authored
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- 05 Nov, 2017 1 commit
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Jake Read authored
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- 04 Nov, 2017 1 commit
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Jake Read authored
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- 03 Nov, 2017 1 commit
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Jake Read authored
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- 01 Nov, 2017 6 commits
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Tomás Vega authored
made the pads of LEDRGBNEW package smaller, the symbol of the H-BRIDGE more compact, and made a new version of the H-BRIDGE device that uses a modified SOIC-8 package that has a ground pad below.
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Grace Copplestone authored
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Grace Copplestone authored
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Grace Copplestone authored
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Grace Copplestone authored
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Grace Copplestone authored
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- 04 Oct, 2017 7 commits
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Neil Gershenfeld authored
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Neil Gershenfeld authored
Patch 1 See merge request !1
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Sam Calisch authored
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Sam Calisch authored
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Sam Calisch authored
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Sam Calisch authored
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Sam Calisch authored
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- 03 Oct, 2017 1 commit
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Neil Gershenfeld authored
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- 23 Jun, 2017 2 commits
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Grace Copplestone authored
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Grace Copplestone authored
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- 22 Jun, 2017 1 commit
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Grace Copplestone authored
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